Whole Maunal/Automatic Printer SMT Solder Paste Stencil Printing Machine for PCBs up to 400x340mm
1.Fully automatic solder paste printing machine achieves accurate printing positioning through vision system. The system is able to automatically identify the characteristics of the printing plate and make precise adjustments according to the preset parameters. It ensures that the printing position is accurate from the whole. Compared with manual operation, automatic tin printing machine can greatly reduce human error and improve the printing quality of products.
2. Automatic solder paste printing machine has high-speed printing ability. The equipment adopts advanced mechanical structure and motion control technology, which can complete the printing task at a faster speed. High-speed printing not only improves the production efficiency, but also reduces the production cycle and increases the production capacity.
3. Automatic solder paste printing machine has automatic operation function at the same time. In the printing process without human intervention, the equipment can automatically complete the printing, calibration and cleaning. This automatic operation not only reduces the time and cost of manual operation, but also improves the accuracy and stability of the operation and reduces the quality problems caused by human factors.
4. Automatic solder paste printing machine also has good flexibility and adaptability, the equipment can be automatically adjusted according to different work requirements into points, suitable for a variety of different sizes, shapes and thicknesses of the printing plate. This flexibility makes the equipment suitable for a variety of different types of electronic products.
5. Automatic tin printing machine in the electronics manufacturing industry plays an important role, through its accurate printing positioning, high-speed printing capacity, automated operation functions and flexible adaptability, the equipment improves the printing quality and production efficiency, for the manufacture of electronic products to provide a reliable guarantee.
Specification
| Model | GSE |
| Stencil size | 370x370mm(min size) |
| 737x737mm(max size) |
| 20-40mm(thickness) |
| Max PCB Size | 400x340mm |
| Min PCB size | 50x50mm |
| PCB thickness | 0.4-6mm |
| PCB warpage | max 1% PCB diagonal |
| Transport height | 900±40mm |
| Transport direction | L-R,R-L |
| Transport speed | max 1500mm/s, can be adjustment |
| Transport method | One stage |
| WIdth adjustment | automatic |
| I/O interface | SMEMA |
| PCB positioning (support method) | Magnetic pin/support block/up-down table |
| PCB clamping system | Patented over the top clamping/side clamping |
| Print head | Two independent motorised printheads |
| Squeegee Pressure | 0.5~10Kg (Program Control) |
| Print Speed | 6-200mm/sec |
| Print Mode | One /Twice |
| Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) |
| Cleaning System | Ireinforced vacuum absorption ,dry ,wet, vacuum three modes |
| CCD FOV | 8x6mm |
| Machine adjust range | X: ± 3mm, Y:± 7 mm , θ:± 2° |
| Vision | Look Up/Down Optics Structure/CCD/Geometry Pattern-match |
Whole Machine Specification
| Repeat Position Accuracy | ±0.01mm |
| Printing Accuracy | ±0.025mm |
| Cycle Time | ＜8 Sec |
| Product Changeover | old:<3 mins,new:<5 mins |
| Air supply | 4~6 kgf/cm |
| Power supply | AC:220±10%,50/60HZ, 2.5KW |
| Control method | PC |
| Operation system | Windows XP/Win7 |
| Machine Dimensions | 1158(L) x 1362(W) x 1463 (H)mm |
| Machine Weight | Approx: around 1000Kg |
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Whole Maunal/Automatic Printer SMT Solder Paste Stencil Printing Machine for PCBs up to 400x340mm Images
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