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Brand Name : HSTECH
Model Number : HS-700
Certification : CE
Place of Origin : China
MOQ : 1 set
Price : Negotiable
Payment Terms : T/T, Western Union, MoneyGram
Supply Ability : 100 sets per month
Delivery Time : 7~9 work days
Packaging Details : Wooden package
Product Name : Mobile Phone BGA Rework Station
Warranty : 1 Year
Control : Touch screen
PLC : MITSUBISHI
Relay Brand : Schneider
Optoelectronic Switch : OMRON
Material : Aluminum Alloy
Condition : New
Thickness : 0.3 - 5mm
Signal : SMEMA
Application : Electronic Assembly
Color : Silver
Control System : PLC
OEM/ODM : Available
Total power : 2600W
Power Supply : AC220V
Air Pressure : 4-6bar
Mounting accuracy : ±0.01mm
Type : Automatic
Weight : 30KG
5 Modes Stepping Motor CCD Color Align System Mobil Phone BGA Rework Station
Specification
Mobile Phone BGA Rework Station | Model:HS-700 |
Power Supply | AC 100V / 220V±10% 50/60Hz |
Total power | 2600W |
Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
Electric material | Driving motor + smart temp. controller + color touch screen |
Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
Sensor | 1pcs |
Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
Overall dimension | L450mm*W470mm*H670mm |
PCB size | Max 140mm*160mm Min 5mm*5mm |
BGA size | Max 50mm*50mm Min 1mm*1mm |
Applicable PCB thickness | 0.3 - 5mm |
Mounting accuracy | ±0.01mm |
Weight of machine | 30KG |
Mount chip weight | 150g |
Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
Usage Repair | chips / phone motherboard etc |
Features
1. The upper and lower heating zone, temperature precision control within ±1℃, which can heat up at the same time from the top of he component to the bottom of the PCB; 8 segment temperature control independently.
2. Hot air district heating for BGA and PCB at the same time, the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.
3. Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system.
4. Temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved; temperature can be tested precisely through external measurement interface, curves can be analysed, set and correct on the touch screen at any time.
About Packaging
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High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair Images |